Industry / Organization Type
Manufacturing (Semiconductor)
Position Title
Service & Application Engineer
Working Location
Science Park
Working Hours
5 days (Mon – Fri, 8.30am – 5.30pm)
Salary Package
Basic salary up to $6,000 + AWS + Variable Bonus
Duration
Permanent Role
Key Responsibilities
- Provide technical support for project and application design proposals.
- Apply analytical problem‑solving skills, handling tight timelines and challenging issues.
- Join internal and external meetings to define specifications for project execution.
- Coordinate between sales / marketing and technical service teams to meet customer needs.
- Support pre‑sales technical discussions and presentations; align on cost and time estimates.
- Maintain strong, hands‑on knowledge of semiconductor front‑of‑line equipment, especially wire bonders (gold / copper / aluminium).
Requirements
Diploma or Degree in Engineering.At least 3 years of relevant experience, preferably with wire bonders and semiconductor assembly.Strong technical knowledge of front‑of‑line (FOL) assembly.Able to travel when required, occasionally within the Asia Pacific region.Application Methods
Email your resume to Please indicate #79534 on the email subject.#J-18808-Ljbffr