Lead Chip-to-Wafer Bonding Scientist for 3D-ICs

A leading research institution in Queenstown seeks a Chip to Wafer Bonding Research Scientist. The role involves developing advanced bonding techniques for semiconductor applications. The candidate must hold a PhD in a relevant field and have experience in semiconductor packaging. Responsibilities include process development, evaluations, and mentoring. This position offers the opportunity to work on cutting-edge technology in a collaborative environment.

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