Lead Chip-To-Wafer Bonding Scientist For 3D-Ics

A leading research institution in Queenstown seeks a Chip to Wafer Bonding Research Scientist.

The role involves developing advanced bonding techniques for semiconductor applications.

The candidate must hold a PhD in a relevant field and have experience in semiconductor packaging.

Responsibilities include process development, evaluations, and mentoring.

This position offers the opportunity to work on cutting-edge technology in a collaborative environment.

#J-

• Ljbffr