Chip to Wafer Bonding Research Scientist (APM), IME

Chip to Wafer Bonding Research Scientist (APM), IME

Agency for Science, Technology and Research – Queenstown

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications.

Job Description

Process Development and Optimization

Innovate and develop new C2W bonding capabilities, including hybrid, fusion, thermocompression, and eutectic bonding methods.

Investigate and refine related processes such as wafer cleaning, planarization (CMP), and post‑bonding annealing, addressing critical factors such as warpage, bonding strength, and alignment accuracy.

Evaluation and Characterization

Plan and execute comprehensive evaluations of processes, materials, and equipment.

Conduct experiments for process characterization, data collection, and analysis to drive quality improvements.

Assess the thermal, mechanical, and electrical performance of the bonded structures, ensuring they meet the requirements for advanced applications such as AI accelerators and 3D‑ICs.

Project Collaboration and Integration

Work closely with process integration teams, project leaders, and senior staff to align on project requirements and troubleshoot issues for industry and grant projects.

Collaborate with internal and external stakeholders, including industry partners and equipment suppliers, to define technology roadmaps and develop next‑generation capabilities.

Documentation and Intellectual Property

Generate detailed engineering reports, research papers, and technical documents.

Contribute to the creation of new intellectual properties (IPs), file patents, and document know‑how related to heterogeneous integration platforms.

Publish research findings in prestigious scientific journals and present at conferences.

Mentorship and Expertise

Act as a subject‑matter expert (SME) for both internal and external stakeholders.

Mentor and inspire scientists, engineers, and talents in the field of advanced semiconductor packaging technology.

Job Requirements

• PhD in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in chip‑to‑wafer bonding process development or packaging R&D, with a strong track record in advanced packaging technologies is an added advantage.
• Relevant experience in semiconductor packaging or process development.

#J-18808-Ljbffr