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Lead Process Engineer - GaN Epitaxy (APM), NSTIC GaN
Lead Process Engineer - GaN Epitaxy (APM), NSTIC GaNAgency for Science, Technology and Research • Queenstown, Otago, New Zealand
Lead Process Engineer - GaN Epitaxy (APM), NSTIC GaN

Lead Process Engineer - GaN Epitaxy (APM), NSTIC GaN

Agency for Science, Technology and Research • Queenstown, Otago, New Zealand
14 days ago
Job description

Lead Process Engineer - GaN Epitaxy (APM), NSTIC GaN

Agency for Science, Technology and Research – Queenstown

We're seeking a talented and passionate Lead Process Engineer to join our epitaxy team. You'll play a crucial role in developing cutting‑edge platform technologies for RF – GaN HEMT devices on SiC, pushing the boundaries of performance and efficiency.

Job Responsibilities

Develop and innovative GaN on SiC HEMT epitaxial processes on an MOCVD system, focusing on recipe development achieving high carrier mobility, low threading dislocation density, on 6 / 8-inch substrates.

Design of experiments to minimize line defects, point defects and extended defects density, with emphasis on enhancing GaN HEMT device performance.

Selective GaN regrowth for contact formation.

Metrology and characterization of GaN / AlGaN epilayers (e.g. carrier mobility, threading dislocation density, FWHM rocking curve, thickness uniformity, surface roughness, crystal quality, stress, carrier mobility, etc.).

Preparation of technical presentations and papers for internal meetings, as well as conferences and journals.

Working with NSTIC-GaN and related team to solve key technical challenges in the GaN RF electronics industry.

Publishing technical papers and drafting technical disclosures / IP.

Contributing ideas towards new funding proposals.

All other reasonable duties, as assigned.

Job Requirements

Master's degree in electrical / Electronic Engineering, Materials Science, Physics, or a related field for Lead Process Engineer position.

Above 8 - 10 years of proven experience in compound semiconductor epitaxy process development / manufacturing (GaN or III-V preferred).

Knowledge of semiconductor processes (lithography, etch, etc.) and characterization techniques (SEM, TEM, XRD, etc.) is a plus.

Excellent communication, collaboration, and self‑motivation skills.

Avid technical reader, critical thinker, and team player.

Proficiency in data analysis and DOE tools (Excel, JMP, Origin, etc.) is beneficial.

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Lead Engineer • Queenstown, Otago, New Zealand

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